In sputtering deposition describe the effects of using krypton, Helium, or Oxygen instead of Argon.
Sputtering is caused by momentum exchange between ions and atoms
of the material, due to collisions.
The ions for the sputtering process are obtained from a plasma
generated inside the spray equipment. Plasma is obtained when
heating a gas can ionize molecules or atoms (reducing or increasing
the number of electrons to form ions).
using krypton, helium or oxygen, the discharge of the electron
density is higher than for a discharge of argon. Therefore the
potential for pulverization is increased with krypton gases,helium
y oxygen compared with argon.
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