Question 3.
(a) Electronic components assembled on thicker boards tends to be more sensitive to shock compared to thinner boards. Why?
(b) Electronic components assembled on thicker boards show shorter thermal cycling characteristic lifecycle time compared to thinner boards. Why?
a) As thicker boards are less flexible compared to thinner boards so they are more sensitive to shock compared to thinner boards. So, electronic components assembled on thicker boards tends to be more sensitive to shock compared to thinner boards.
b)Thinner boards are more flexible, resulting in greater reliability during thermal cycling and improved thermal fatigue life in comparison to thicker boards.So, electronic components assembled on thicker boards show shorter thermal cycling characteristic lifecycle time compared to thinner boards
Get Answers For Free
Most questions answered within 1 hours.