Question

Multilevel configuration needed to implement interconnect network in advanced ICs requires special solutions with regard to the interlayer isolation. Explain what those requirements are and what materials (be specific) are used.

Answer 1

The Multilevel configuration needed to implement interconnect network in advanced ICs requires special solutions with regard to the interlayer isolation those requirements are to electrically separate closely spaced interconnect lines in several levels in advanced integrated circuit.

The material has dielectric constant less than of SiO₂ ( 3.9) are used. Those materials are Hexagonal Boron Nitride (h-BN), carbon doped oxide dielectrics comprised of Si, C, O, and H (SiCOH), etc. are used.