With aid of diagram, summary in detail of important steps involved in forming a layer of thin film on a nanostructure's substrate.
There are many physical and chemical methods for forming a thin film on the substrate.
Here one Physical method is described known as Sputtering Gases. Following are the steps followed to form thin film
1) Initially the substrate is kept in a chamber and high vaccum of the order of 10-7 torr is created.
2) Inert gas like argon is passed in the chamber now.
3) Sputtering target is connected to RF/DC power supply, Now Electric Field from Target to substrate ionize the inert gas which form Ar+ ions and glow.
4) These ionized argon atoms hits the substrate and causes atoms of targe release which gets deposited on the substrate.
Now the thickness of film can be controlled by adjusting the sputter time, chamber pressure, Power supply values.
Following picture depicts the mechanism of thin film formation.
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